Intel Joins Industry Consortium to Accelerate Confidential Computing

Produits Intel - mer, 21/08/2019 - 18:10

By Lorie Wigle

Leaders in information and infrastructure security are well versed in protecting data at-rest or in-flight through a variety of methods. However, data being actively processed in memory is another matter. Whether running on your own servers on-prem, in an edge deployment, or in the heart of a cloud service provider’s data center, this “in-use” data is almost always unencrypted and potentially vulnerable.

Intel’s commitment to helping customers and the ecosystem at large with data protection is why we and other industry leaders are coming together to form a new Confidential Computing Consortium under the Linux Foundation. We’re proud to be a founding member of this new industry group dedicated to making confidential computing practices, such as the protection of data in-use, easier to adopt in today’s multi-cloud world.

Confidential Computing Protects Data In-Use

Confidential computing may take multiple forms, but early use cases rely on trusted execution environments (TEE), also called trusted enclaves, where data and operations are isolated and protected from any other software, including the operating system and cloud service stack. Combined with encrypted data storage and transmission methods, TEEs can create an end-to-end protection architecture for your most sensitive data.

Enterprises and cloud service providers can apply confidential computing to a wide range of workloads. The most popular of the early use cases use the trusted enclave for key protection and crypto-operations. But trusted enclaves can be used to protect any type of highly sensitive information.  For example, healthcare analytics can be performed so that the enclave protects any data that may contain personally identifiable information, thus keeping results anonymous.

Companies that wish to run their applications in the public cloud but don’t want their most valuable software IP visible to other software or the cloud provider can run their proprietary algorithms inside an enclave. Multiple untrusted parties can share transactions but protect their confidential or proprietary data from the other parties by using enclaves. Any time sensitive data is in use, there may be an opportunity to use confidential computing to better protect it.

Intel SGX – The Hardware Engine Powering Confidential Computing

The Confidential Computing Consortium is initially focused on common programming models and enclave portability, but the Consortium doesn’t prescribe the hardware mechanism necessary for creating and protecting the enclave. That’s where Intel® Software Guard Extensions (Intel® SGX) comes in.

Intel SGX is a hardware-based technology that helps protect data in-use by establishing protected enclaves in memory so only authorized application code can access sensitive data. Unlike full memory encryption technologies that leave the data within the attack surface of the OS and cloud stack, Intel SGX allows a specific application to create its own protected enclave with a direct interface to the hardware, limiting access and minimizing the overall performance impact for both the application and any other virtual machines (VMs) or tenants on the server.

Intel SGX provides hardware-based encryption for data in-use protection at the application level with the smallest attack surface. Intel SGX is available today on Intel® Xeon® processor E-2100 family, and is used in confidential computing services from Microsoft Azure*, IBM Cloud Data Guard*, Baidu*, Alibaba Cloud* and Equinix*. Later this year, we will release a PCI-Express add-in card that will enable Intel SGX in multi-socket Intel Xeon Scalable servers. And Intel SGX will continue to be rolled out across our mainstream Xeon platforms in upcoming generations.

As part of today’s announcement of the new Confidential Computing Consortium, I am pleased to share that we are contributing the Intel SGX SDK to this new community to help simplify secure enclave development and deployment.

The launch of the Confidential Computing Consortium is a big step in bringing this powerful security capability to a broader audience, and we are committed to working with our ecosystem customers to ease use and portability of confidential computing for developers and IT pros.  We invite developers to learn about how to integrate Intel SGX into their applications and cloud services today, and the future of the consortium at its website.

Lorie Wigle is vice president in the Architecture, Graphics and Software Group and general manager of Platform Security Product Management at Intel Corporation.

The post Intel Joins Industry Consortium to Accelerate Confidential Computing appeared first on Intel Newsroom.

Intel Expands 10th Gen Intel Core Mobile Processor Family, Offering Double Digit Performance Gains

Produits Intel - mer, 21/08/2019 - 15:00
Intel Corporation in August 2019 introduced eight 10th Gen Intel Core processors for modern laptop computing. The new mobile PC processors (formerly code-named “Comet Lake”) are tailor-made to deliver increased productivity and performance scaling for demanding, multithreaded workloads while still enabling thin-and-light laptop and 2 in 1 designs. (Credit: Intel Corporation)
» Click for full image

What’s New: Today, Intel introduced eight additional 10th Gen Intel® Core™ processors for modern laptop computing. The new mobile PC processors (formerly code-named “Comet Lake”) are tailor-made to deliver increased productivity and performance scaling for demanding, multithreaded workloads while still enabling thin-and-light laptop and 2 in 1 designs with uncompromising battery life1. These processors are performance powerhouses that bring double digit performance gains compared with the previous generation2. The lineup also includes Intel’s first 6-core processor in the U-series, faster CPU frequencies, faster memory interfaces and the industry redefining connectivity with Intel® Wi-Fi 6 (Gig+) and broader scaling of Thunderbolt™ 3. More than 90 additional designs based on the 10th Gen Intel Core processor family will hit the shelves for the holiday season.

“Our 10th Gen Intel Core mobile processors provide customers with the industry-leading range of products that deliver the best balance of performance, features, power and design for their specific needs. From multitasking to everyday content creation, the newest additions to the family scale performance for even higher levels of productivity — in addition to offering best-in-class platform connectivity via Wi-Fi 6 (Gig+) and Thunderbolt 3 that people expect with 10th Gen.”
–Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms in the Client Computing Group

Why It Matters: Taking advantage of Intel’s world-class portfolio of technologies and intellectual property, the 10th Gen Intel Core processor family delivers a range of workload-optimized platforms to address diverse computing needs and experiences. The new 10th Gen Intel Core processors leverage the improvements in intra-node optimizations on Intel’s highly optimized 14nm process technology that enable up to 16% overall performance gains2 and over 41% better productivity and multitasking on Microsoft Office 365* compared with the previous generation3 — all without compromising battery life1. Additionally, they integrate the best wireless connectivity with Intel WiFi6 (Gig+)4 and support Thunderbolt 3, the fastest and most versatile port available5.

Earlier this month, Intel launched the first products in 10th Gen Intel Core processor family, which were developed on the 10nm process technology and focus on bringing high-performance artificial intelligence (AI) to the PC at scale, a big leap forward in graphics performance and best-in-class connectivity. The new processors introduced today share the same leading platform connectivity, while expanding the family with processors for scaling performance and frequencies for modern productivity workloads. The result is a complete family of processors that complement each other, giving people choices for what usages matter most to them and re-imagining the possibilities of a modern laptop experience.

What They Feature:

The new 10th Gen Intel Core processors range from Intel Core i3 to Intel Core i7 and feature:

  • Up to 6 cores and 12 threads
  • Up to 4.9 GHz max turbo frequency
  • Up to 12MB Intel Smart Cache
  • Configurable up to 25W for maximum performance (U-series)
  • Configurable down to 4.5W for 4-core fanless designs (Y-series)
  • Up to 1.15 GHz graphics frequency
  • LPDDR4x, LPDDR3, DDR4 memory speed increase to 2666 MT/s

People can also expect the same great connectivity across the entire 10th Gen Intel Core processor family. Integrated Intel Wi-Fi 6 (Gig+) brings enhanced WPA3 security for additional peace of mind and is nearly 3 times faster6 to enable quick file downloads and more responsive performance throughout the home. Systems with these processors also support Thunderbolt 3 controllers enabling up to four Thunderbolt 3 ports, each capable of delivering power, download speeds of 40 Gb/s and connecting to the thousands of docks, displays and peripherals in the market, all via a single cable.

Finally, the new processors scale the number of designs optimized with Intel® Adaptix™ Technology, supporting modern standby for faster wake and enabling multiple voice assistant services built into the PCs. Within Intel Adaptix Technology, Intel® Dynamic Tuning Technology enables OEM partners to tune 10th Gen Intel Core processor-based systems to achieve even more performance — ranging from 8% to 12% on a typical system7. On select designs, Intel Dynamic Tuning Technology now offers the first ever AI-based pre-trained algorithms to predict workloads and allow higher turbo burst when responsiveness is needed and extended time in turbo for sustained workloads.

How to Get Them: Laptops and 2 in 1s powered by the new 10th Gen Intel Core processors will be available from PC manufacturers for the holiday season. Select systems from PC manufacturers based on 10th Gen Intel Core processors are on track for verification through Intel’s innovation program code-named “Project Athena.” Look for the “Engineered for Mobile Performance” signage online and in retail stores this fall for the best of 10th Gen Intel Core processor-based systems from PC manufacturers.

More Context: 10th Gen Intel Core Press Kit | 10th Gen Intel Core Product Brief | 10th Gen Intel Core Press Deck

The Details:

Processor Number IA Cores/ Threads Graphics (EUs) Cache Nominal TDP/
Config UP TDP Base Freq (GHz) Max Single
Core Turbo (GHz) Max All Core Turbo (GHz) Graphics
Max Freq (GHz) Memory

Support Intel® Core™ i7-10710U 6/12 24 12MB 15W/25W 1.1 4.7 3.9 1.15 LPDDR4x 2933

LPDDR3 2133

DDR4 2666 U-Series Intel® Core™ i7-10510U 4/8 24 8MB 15W/25W 1.8 4.9 4.3 1.15 LPDDR4x 2933

LPDDR3 2133

DDR4 2666 Intel® Core™ i5-10210U 4/8 24 6MB 15W/25W 1.6 4.2 3.9 1.10 LPDDR4x 2933

LPDDR3 2133

DDR4 2666 Intel® Core™ i3-10110U 2/4 23 4MB 15W/25W 2.1 4.1 3.7 1.00 LPDDR4x 2933

LPDDR3 2133

DDR4 2666 Processor Number IA Cores/ Threads Graphics

(EUs) Cache Config Down TDP/

Nominal TDP/
Config UP TDP Base Freq (GHz) Max Single
Core Turbo
(GHz) Max All Core Turbo
(GHz) Graphics Max Freq
(GHz) Memory

Support Y-Series Intel® Core™ i7-10510Y 4/8 24 8MB 4.5W/7W/9W 1.2 4.5 3.2 1.15 LPDDR3 2133 Intel® Core™ i5-10310Y 4/8 24 6MB 5.5W/7W/9W 1.1 4.1 2.8 1.05 LPDDR3 2133 Intel® Core™ i5-10210Y 4/8 24 6MB 4.5W/7W/9W 1.0 4.0 2.7 1.05 LPDDR3 2133 Intel® Core™ i3-10110Y 2/4 24 4MB 5.5W/7W/9W 1.0 4.0 3.7 1.00 LPDDR3 2133

The Small Print:

Intel, Core, Optane, Thunderbolt and the Intel logo are trademarks of Intel Corporation in the United States and/or other countries.

Performance results are based on testing as of dates shown in configuration and may not reflect all publicly available security updates. See configuration disclosure for details. No product or component can be absolutely secure.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit www.intel.com/benchmarks.

Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. Check with your system manufacturer or retailer or learn more at intel.com.

Results have been estimated or simulated using internal Intel analysis or architecture simulation or modeling, and provided to you for informational purposes. Any differences in your system hardware, software or configuration may affect your actual performance.

1Battery Life estimated based on measurements of average power on an Intel reference platform for a local video playback of a 1080p 24fps h.264 7Mbps 12min 14 sec content using the Windows Movie & TV App.  Intel Preproduction Processor: Intel® Core™ i7 -10710U (CML-U 6+2) PL1=15W, 6C12T, Turbo up to 4.7GHz, Memory: 2x16GB DDR4-2667 2Rx8, Storage: Intel® 760p M.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 19H1-18362.ent.rx64-Appx59. Power policy set to AC/Balanced mode for all benchmarks except SYSmark 2014 SE which is measured in AC/BAPCo mode for Performance. Power policy set to DC/Balanced mode for power with UX Slider set to Better Performance. All benchmarks run in Admin mode & Tamper Protection Disabled / Defender Disabled, Graphics driver: PROD-HC-RELEASES-GFX-DRIVER-CI-MASTER-2334-REVENUE-PR-1006952-WHQL. vs Intel® Core™ i7-8565U PL1=15W, 4C8T, Memory: 2x16GB DDR4-2667 2Rx8, Storage: Intel® 760p M.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 19H1-18362.ent.rx64-Appx59. Power policy set to AC/Balanced mode for all benchmarks except SYSmark 2014 SE which is measured in AC/BAPCo mode for Performance. Power policy set to DC/Balanced mode for power. All benchmarks run in Admin mode & Tamper Protection Disabled / Defender Disabled, Graphics driver: 2019-1006577-WHQL.

2As measured by SYSmark2018 Overall Score. Intel Preproduction Processor: Intel® Core™ i7 -10710U (CML-U 6+2) PL1=25W, 6C12T, Turbo up to 4.7GHz, Memory: 2x16GB DDR4-2667 2Rx8, Storage: Intel® 760p M.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 19H1-18362.ent.rx64-Appx59. Power policy set to AC/Balanced mode for all benchmarks except SYSmark 2014 SE which is measured in AC/BAPCo mode for Performance. Power policy set to DC/Balanced mode for power. All benchmarks run in Admin mode & Tamper Protection Disabled / Defender Disabled, Graphics driver: PROD-HC-RELEASES-GFX-DRIVER-CI-MASTER-2334-REVENUE-PR-1006952-WHQl. vs Processor: Intel® Core™ i7-8565U (WHL-U4+2) PL1=15W TDP, 4C8T, Turbo up to 4.6GHz, Memory: 2x16GB DDR4-2400 2Rx8, Storage: Intel® 760p m.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 19H1-18362.ent.rx64-Appx59. Power policy set to AC/Balanced mode for all benchmarks except SYSmark 2014 SE which is measured in AC/BAPCo mode for Performance. Power policy set to DC/Balanced mode for power with UX Slider set to Better Performance. All benchmarks run in Admin mode & Tamper Protection Disabled / Defender Disabled, Graphics driver: 2019-1006577-WHQL.

3As measured by the time it takes Microsoft Office to perform 3 tasks in a multitasking scenario (export PowerPoint file to video, export word doc to pdf and excel calculation). Intel Preproduction Processor: Intel® Core™ i7 -10710U (CML-U 6+2) PL1=25W, 6C12T, Turbo up to 4.7GHz, Memory: 2x16GB DDR4-2667 2Rx8, Storage: Intel® 760p M.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 19H1-18362.ent.rx64-Appx59. Power policy set to AC/Balanced mode for all benchmarks except SYSmark 2014 SE which is measured in AC/BAPCo mode for Performance. Power policy set to DC/Balanced mode for power. All benchmarks run in Admin mode & Tamper Protection Disabled / Defender Disabled, Graphics driver: PROD-HC-RELEASES-GFX-DRIVER-CI-MASTER-2334-REVENUE-PR-1006952-WHQl. vs Processor: Intel® Core™ i7-8565U (WHL-U4+2) PL1=15W TDP, 4C8T, Turbo up to 4.6GHz, Memory: 2x16GB DDR4-2400 2Rx8, Storage: Intel® 760p m.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 19H1-18362.ent.rx64-Appx59. Power policy set to AC/Balanced mode for all benchmarks except SYSmark 2014 SE which is measured in AC/BAPCo mode for Performance. Power policy set to DC/Balanced mode for power with UX Slider set to Better Performance. All benchmarks run in Admin mode & Tamper Protection Disabled / Defender Disabled, Graphics driver: 2019-1006577-WHQL.

4Intel® Wi-Fi 6 (Gig+) products support optional 160 MHz channels, enabling the fastest possible theoretical maximum speeds (2402 Mbps) for typical 2×2 802.11 AX PC Wi-Fi products.   Premium Intel® Wi-Fi 6 (Gig+) products enable 2-4X faster maximum theoretical speeds compared standard 2×2 (1201 Mbps) or 1×1 (600 Mbps) 802.11 AX PC Wi-Fi products, which only support the mandatory requirement of 80 MHz channels.

5As compared to other PC I/O connection technologies including eSATA, USB, and IEEE 1394 Firewire*. Performance will vary depending on the specific hardware and software used. Must use a Thunderbolt™-enabled device.

6802.11ax 2×2 160MHz enables 2402Mbps maximum theoretical data rates, ~3X (2.8X) faster than standard 802.11ac 2×2 80MHz (867Mbps) as documented in IEEE 802.11 wireless standard specifications, and require the use of similarly configured 802.11ax wireless network routers.

7As measured by the time it takes to export a project containing 4K 360 video using PowerDirector 365. The exported video is a 4K, HEVC, 30p, .MP4 @ 37Mbps using the CPU only. Comparisons baselined off of a fixed 15W cooling vs. 18W with DTT and 25W with DTT measurements based on an Intel Preproduction Processor Intel® Core™ i7 -10710U. Performance will vary based on OEM chassis design choices, chassis temperature thresholds, cooling solutions, form factors, and ambient air temperatures. Intel Preproduction Processor: Intel® Core™ i7 -10710U (CML-U 6+2) PL1=18W/25W, 6C12T, Turbo up to 4.7GHz, Memory: 2x16GB DDR4-2667 2Rx8, Storage: Intel® 760p M.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 19H1-18362.ent.rx64-Appx59., Graphics driver: PROD-HC-RELEASES-GFX-DRIVER-CI-MASTER-2334-REVENUE-PR-1006952-WHQL.

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At Hot Chips, Intel Pushes ‘AI Everywhere’

Produits Intel - mar, 20/08/2019 - 17:00

What’s New: At Hot Chips 2019, Intel revealed new details of upcoming high-performance artificial intelligence (AI) accelerators: Intel® Nervana™ neural network processors, with the NNP-T for training and the NNP-I for inference. Intel engineers also presented technical details on hybrid chip packaging technology, Intel® Optane™ DC persistent memory and chiplet technology for optical I/O.

“To get to a future state of ‘AI everywhere,’ we’ll need to address the crush of data being generated and ensure enterprises are empowered to make efficient use of their data, processing it where it’s collected when it makes sense and making smarter use of their upstream resources. Data centers and the cloud need to have access to performant and scalable general purpose computing and specialized acceleration for complex AI applications. In this future vision of AI everywhere, a holistic approach is needed—from hardware to software to applications.”
–Naveen Rao, Intel vice president and general manager, Artificial Intelligence Products Group

Why It’s Important: Turning data into information and then into knowledge requires hardware architectures and complementary packaging, memory, storage and interconnect technologies that can evolve and support emerging and increasingly complex use cases and AI techniques. Dedicated accelerators like the Intel Nervana NNPs are built from the ground up, with a focus on AI to provide customers the right intelligence at the right time.

What Intel Presented at Hot Chips 2019:

Intel Nervana NNP-T: Built from the ground up to train deep learning models at scale: Intel Nervana NNP-T (Neural Network Processor) pushes the boundaries of deep learning training. It is built to prioritize two key real-world considerations: training a network as fast as possible and doing it within a given power budget. This deep learning training processor is built with flexibility in mind, striking a balance among computing, communication and memory. While Intel® Xeon® Scalable processors bring AI-specific instructions and provide a great foundation for AI, the NNP-T is architected from scratch, building in features and requirements needed to solve for large models, without the overhead needed to support legacy technology. To account for future deep learning needs, the Intel Nervana NNP-T is built with flexibility and programmability so it can be tailored to accelerate a wide variety of workloads – both existing ones today and new ones that will emerge. View the presentation for additional technical detail into Intel Nervana NNP-T’s (code-named Spring Crest) capabilities and architecture.

Intel Nervana NNP-I: High-performing deep learning inference for major data center workloads: Intel Nervana NNP-I is purpose-built specifically for inference and is designed to accelerate deep learning deployment at scale, introducing specialized leading-edge deep learning acceleration while leveraging Intel’s 10nm process technology with Ice Lake cores to offer industry-leading performance per watt across all major datacenter workloads. Additionally, the Intel Nervana NNP-I offers a high degree of programmability without compromising performance or power efficiency. As AI becomes pervasive across every workload, having a dedicated inference accelerator that is easy to program, has short latencies, has fast code porting and includes support for all major deep learning frameworks allows companies to harness the full potential of their data as actionable insights. View the presentation for additional technical detail into Intel Nervana NNP-I’s (code-named Spring Hill) design and architecture.

Lakefield: Hybrid cores in a three-dimensional package: Lakefield introduces the industry’s first product with 3D stacking and IA hybrid computing architecture for a new class of mobile devices. Leveraging Intel’s latest 10nm process and Foveros advanced packaging technology, Lakefield achieves a dramatic reduction in standby power, core area and package height over previous generations of technology. With best-in-class computing performance and ultra-low thermal design power, new thin form-factor devices, 2 in 1s, and dual-display devices can operate always-on and always-connected at very low standby power. View the presentation for additional technical detail into Lakefield’s architecture and power attributes.

TeraPHY: An in-package optical I/O chiplet for high-bandwidth, low-power communication: Intel and Ayar Labs demonstrated the industry’s first integration of monolithic in-package optics (MIPO) with a high-performance system-on-chip (SOC). The Ayar Labs TeraPHY* optical I/O chiplet is co-packaged with the Intel Stratix 10 FPGA using Intel Embedded Multi-die Interconnect Bridge (EMIB) technology, offering high-bandwidth, low-power data communication from the chip package with determinant latency for distances up to 2 km. This collaboration will enable new approaches to architecting computing systems for the next phase of Moore’s Law by removing the traditional performance, power and cost bottlenecks in moving data. View the presentation for additional technical detail and design decisions on creating processors with optical I/O.

Intel Optane DC persistent memory: Architecture and performance: Intel Optane DC persistent memory, now shipping in volume, is the first product in the memory/storage hierarchy’s entirely new tier called persistent memory. Based on Intel® 3D XPoint™ technology and in a memory module form factor, it can deliver large capacity at near-memory speeds, latency in nanoseconds, while also natively delivering the persistence of storage. Details of the two operational modes (memory mode and app direct mode) as well performance examples show how this new tier can support a complete re-architecting of the data supply subsystem to enable faster and new workloads. View the presentation for additional architectural details, memory controller design, power fail implementation and performance results for Intel Optane DC persistent memory.

More context:  “Accelerating with Purpose” for AI Everywhere (Naveen Rao Blog) | Artificial Intelligence at Intel

The post At Hot Chips, Intel Pushes ‘AI Everywhere’ appeared first on Intel Newsroom.

Intel, Microsoft Research and Duality Technologies Convene AI Community for Privacy Standards

Produits Intel - ven, 16/08/2019 - 15:00

What’s New: Intel, Microsoft Research* and Duality Technologies* are bringing nearly 100 security, privacy and artificial intelligence (AI) community members together to create standards for homomorphic encryption (HE), which is emerging as a leading method to protect privacy in machine learning and cloud computing. The HE standards workshop will take place on Intel’s Santa Clara, California campus on Aug. 17, 2019.

“Many of the AI systems that we use and enjoy today are built on and shaped by data, which can be private and sensitive. As homomorphic encryption gains momentum, Intel is proud to collaborate with Microsoft Research and Duality Technologies on standardizing homomorphic encryption to unlock the power of AI, while still respecting and protecting data privacy.”
–Casimir Wierzynski, senior director, office of the CTO, AI Products Group, Intel

Why It Matters: As more data is collected and used to power AI systems, concerns about privacy are on the rise. A recent study by Intouch International* found that 9 in 10 internet users in the U.S. are concerned about the privacy and security of their personal information online. As interest in privacy preserving methods for machine learning grows, it’s essential for standards to be debated and agreed upon by the community – spanning both business and academia.

“Microsoft has invested heavily in developing Homomorphic Encryption, including the release of Microsoft SEAL for commercial use, as a tool to protect enterprise and consumer privacy, while bringing the full power of ML algorithms to process data in the cloud,” said Kristin Lautner, partner research manager, Cryptography and Privacy Research Group, Microsoft. “The Standardization process for Homomorphic Encryption is a key step towards wider acceptance and adoption of this important new encryption tool by industry and governments world-wide.  We are confident that the collaboration between Microsoft, Intel, and Duality Technologies on the 4th Homomorphic Encryption Standardization Workshop will accelerate the standardization process and decrease the time to commercial availability of this important privacy protection tool.”

About the Workshop: Targeted at researchers, application developers, security practitioners and encryption experts, the full-day workshop will provide an introduction to HE, review usability for application developers and real-life applications, present the latest research, and include a group discussion on creating HE standards. For those interested but unable to attend, key takeaways will be available online after the workshop, in addition to an HE webinar series from Microsoft.

How Homomorphic Encryption Works: HE allows AI computation on encrypted data, enabling data scientists and researchers to gain valuable insights without decrypting or exposing the underlying data or models. This is particularly useful in instances where data may be sensitive – such as with medical or financial data.

“As a provider of a data science platform optimized for homomorphic encryption, we are excited to be working with Intel and Microsoft Research on this industry standardization initiative,” said Kurt Rohloff, CTO and co-founder of Duality Technologies and associate professor, New Jersey Institute of Technology. “Homomorphic encryption standards are opening the market to a broad range of participants on all layers of the secure computing stack – industry, science, governments, academia, and beyond. Standards are accelerating the adoption of privacy-enhanced information sharing across regulated industries, helping reconcile data utility and data privacy.”

In 2018, Intel open-sourced HE-Transformer, allowing data scientists to develop neural networks on popular open-source frameworks and then easily deploy them to operate on encrypted data.

More Context: HE-Transfomer for nGraph: Enabling Deep Learning on Encrypted Data | AI & Security Innovations Help Developers Preserve Privacy While Delivering Insight | Rethinking Privacy in the Age of AI | Advancing Both AI and Privacy is Not a Zero-Sum Game | Why it is time to standardize privacy-enhancing technologies | Homomorphic Encryption: Making it Real

Intel does not control or audit third-party data.  You should review this content, consult other sources, and confirm whether referenced data are accurate.

All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps.

The post Intel, Microsoft Research and Duality Technologies Convene AI Community for Privacy Standards appeared first on Intel Newsroom.

Intel Debuts Visual Identifier for Project Athena; Verified Designs from Dell and HP

Produits Intel - jeu, 08/08/2019 - 15:00

What’s New: Today, Intel announced that laptops verified through its innovation program, code-named “Project Athena,” will feature the visual identifier “Engineered for Mobile Performance.” PC manufacturers and retailers can use the identifier across promotional activities and in-store and online retail environments to draw consumers to the laptops that meet the high standards of the program’s target specification and key experience indicators (KEI).

The new identifier can be found for the first time today with the new Dell XPS 13 2-in-1*, one of the initial systems verified through Project Athena and now available for U.S. customers to purchase from Dell.com. Over the coming weeks, the identifier will also be visible in marketing efforts for the HP EliteBook x360 1040* and HP EliteBook x360 830*, which are also among the initial laptops verified through the program. Additional laptops are expected from Acer*, Asus*, Dell*, HP*, Lenovo* and Samsung* for the holiday season.

“With Project Athena, we are fundamentally changing our approach to innovation by defining the program and its methodologies through the lens of how people use their devices every day. On-the-move, ambitious people turn to their laptops across every facet of their lives – work, home, and passion projects. ‘Engineered for Mobile Performance’ refers to the high-quality experience consumers can expect from these laptops enabled by deep co-engineering from Intel and its partners.”
–Josh Newman, Intel vice president and general manager of PC Innovation Segments in the Client Computing Group

Why It Matters: Project Athena is Intel’s ambitious innovation program aimed at delivering a new class of advanced laptops that help people to focus, to be always ready and to adapt to different roles throughout the day. With support from more than 100 partners across the ecosystem, Intel’s long-term commitment with Project Athena includes ongoing research to define new experience targets and product specifications, co-engineering support, innovation pathfinding and joint marketing efforts. Through broad ecosystem collaboration, the program will drive innovation across the entire PC platform to create better experiences on the laptop and help people do the things that matter most to them.

Research suggests that consumers often rely on visual signals and retail displays to inform their buying decisions. Testing of the identifier and its messaging showed that it grabbed people’s attention in stores and online and indicates how the laptops are the result of engineering collaborations specifically designed for on-the-go PC experiences.

How It Works: In this first year of the program, the “Engineered for Mobile Performance” identifier indicates that the laptop has been co-engineered with Intel to meet the foundational KEIs of the program.

Laptops featuring the identifier will have passed the verification process, a robust and iterative process led by Intel engineers, that includes meeting specified platform requirements and KEI targets across six innovation vectors: instant action, performance and responsiveness, intelligence, battery life, connectivity and form factor.

The identifier can be used across PC manufacturer, retailer and other online listings and product detail pages, as well as on in-store display systems, demos and packaging. For applicable 10th Gen Intel® Core™ processor-based systems, the designation will be used in conjunction with 10th Gen Intel Core processor badges.

For highlights of the 1.0 target specification1 and KEIs, see the Project Athena fact sheet. More than a dozen designs from PC manufacturers are expected to be aligned with the first target specification.

More Context: Project Athena Press Kit | Fact Sheet

Intel, Core and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at intel.com.

1Project Athena targets are preliminary and subject to change. Intel does not guarantee performance of any third-party system

The post Intel Debuts Visual Identifier for Project Athena; Verified Designs from Dell and HP appeared first on Intel Newsroom.

Next-generation Intel Xeon Scalable Processors to Deliver Breakthrough Platform Performance with up to 56 Processor Cores

Produits Intel - mar, 06/08/2019 - 14:00


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What’s New: Intel today announced its next-generation Intel® Xeon® Scalable processor family (code-named “Cooper Lake”) will offer customers up to 56 processor cores per socket and built-in AI training acceleration in standard socketed  Intel Xeon Scalable processor offerings with availability starting in the first half of 2020. The breakthrough platform performance delivered within the high-core-count Cooper Lake processors will leverage the capabilities built into the Intel® Xeon® Platinum 9200 series, which today is gaining momentum among the world’s most demanding HPC and AI customers, including HLRN*, Advania*,  and others.

We are excited about the early customer deployments of the Intel Xeon Platinum 9200 series that we introduced as part of our 2nd Generation Intel Xeon Scalable processor family. Bringing a 56-core processor into our mainline Intel Xeon Scalable processor family in the next generation will further expand our ability to address customer needs for the highest levels of performance in artificial intelligence, high performance computing and high density infrastructure.
–Lisa Spelman, vice president and general manager of Data Center Marketing, Intel Corporation

What This Processor Will Offer:The next-generation Intel Xeon Scalable processor platform will deliver twice the processor core count (up to 56 cores), higher memory bandwidth, and higher AI inference and training performance compared with the standard Intel Xeon Platinum 8200 platforms. Cooper Lake will be the first x86 processor to deliver built-in AI training acceleration through new bfloat16 support added to Intel® Deep Learning Boost® (Intel® DL Boost®). Cooper Lake will have platform compatibility with the upcoming 10nm Ice Lake processor.

Why It’s Important: For more than 20 years, Intel Xeon processors have delivered the platform and performance leadership that gives data center customers the flexibility to pick the right solution for their computing needs. Next-generation Intel Xeon Scalable processors (Cooper Lake) build off Intel’s uninterrupted server processor track record by delivering leadership performance for customers’ real-world workloads and business application needs.

Learn More: Intel Xeon Platinum 9200 processors are available for purchase today as part of a pre-configured systems from select OEMs, including Atos*, HPE*, Lenovo*, Penguin Computing*, Megware* and authorized Intel resellers. Learn more information about the Intel Xeon Platinum 9200 processors.

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Intel Expands Workload Acceleration with Hewlett Packard Enterprise in New Programmable Acceleration Card

Produits Intel - lun, 05/08/2019 - 16:00


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What’s New: Intel announced today it is working with Hewlett Packard Enterprise* (HPE) to provide increased workload acceleration capacity for the HPE ProLiant DL380 Gen10 server. This will address computing-intensive markets – like streaming analytics, media transcoding, financial technology and network security – with the new high-performance Intel® FPGA Programmable Acceleration Card (Intel® FPGA PAC) D5005. The Intel FPGA PAC D5005 is the second card in the Intel PAC Portfolio and is shipping now in the HPE ProLiant DL3809 Gen10 server.

“The HPE ProLiant Gen10 server family is the world’s most secure, manageable and agile server platform available on the market today. By integrating the Intel FPGA PAC D5005 accelerator into the HPE ProLiant DL380 Gen10 server, we are now delivering optimized configurations for an increasing number of workloads, including AI inferencing, big data and streaming analytics, network security and image transcoding. Combined with our broad portfolio of services from HPE Pointnext, we enable our customers to accelerate time-to-value and increase ROI.”
– Bill Mannel, vice president and general manager, HPC and AI, at Hewlett Packard Enterprise

Why It’s Important: Applications like streaming analytics, artificial intelligence (including speech to text) and media transcoding require large amounts of computational capability to meet today’s increasing demands. Data center customers use hardware accelerators for specific workloads that can most benefit from field programmable gate array-based (FPGA) hardware acceleration. Diverting such tasks to tailored hardware accelerators offloads suitable workloads and frees a server’s CPU cycles for higher value workloads. Offloading appropriate workloads lowers the data center operator’s total cost of ownership.

The new Intel FPGA PAC D5005 offers more logic, memory and networking capability than previous PACs. The Intel FPGA PAC D5005 is now qualified in the HPE ProLiant DL380 Gen10 server, offering customers a higher performance PAC option in addition to the already shipping Intel PAC with Intel® Arria® 10 GX FPGA.

What It Does: The Intel FPGA PAC D5005 acceleration card, which is based on an Intel® Stratix® 10 SX FPGA, provides high-performance inline and lookaside workload acceleration to servers based on Intel® Xeon® Scalable processors using the Intel Acceleration Stack, which includes acceleration libraries and development tools.

The Details: HPE is the first server OEM to announce pre-qualification of the Intel FPGA PAC D5005 accelerator card for use with its servers, specifically the HPE ProLiant DL380 Gen10 server. Other server vendors are also qualifying the Intel FPGA PAC D5005 accelerator card. Initial workloads specifically developed for the Intel FPGA PAC D5005 accelerator card include:

  • AI (speech-to-text translation) from Myrtle*
  • Network security from Algo-Logic*
  • Image transcoding from CTAccel*
  • Video transcoding from IBEX*

The Intel FPGA PAC D5005 accelerator card is the latest in a growing line of FPGA-based server-accelerator cards from Intel. Compared with the Intel programmable acceleration card with Intel Arria 10 GX FPGA, the Intel FPGA PAC D5005 accelerator card offers significantly more resources including three times the amount of programmable logic, as much as 32 GB of DDR4 memory (a 4x increase) and faster Ethernet ports (two 100GE ports versus one 40GE port). With a smaller physical and power footprint, the Intel PAC with Intel Arria 10 GX FPGA fits a broader range of servers, while the Intel PAC D5005 is focused on providing a higher level of acceleration.

More Context: Customers can benefit now from simplified ordering, streamlined system integration and assured interoperability. To buy, visit HPE. To learn more, read the product brief.

The Small Print:

Results have been estimated or simulated using internal Intel analysis, architecture simulation, and modeling, and provided to you for informational purposes. Any differences in your system hardware, software or configuration may affect your actual performance.

Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase.  For more complete information about performance and benchmark results, visit www.intel.com/benchmarks.

Intel does not control or audit third-party benchmark data or the websites referenced in this document. You should visit the referenced website and confirm whether referenced data are accurate.

Intel and the Intel logo, Stratix, Arria are trademarks of Intel Corporation in the United States and other countries.

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Lenovo and Intel Announce Multiyear Global Collaboration to Extend HPC and AI Leadership

Produits Intel - lun, 05/08/2019 - 14:00


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SANTA CLARA, Calif., Aug. 5, 2019 — Intel and Lenovo today announced a multiyear collaboration focused on the rapidly growing opportunity in the convergence of high-performance computing (HPC) and artificial intelligence (AI) to help accelerate solutions for the world’s most challenging problems. Building on the companies’ long-standing partnership in the data center, the multiyear global collaboration will speed the convergence of HPC and AI, creating solutions for organizations of all sizes.

Lenovo, the leading global system provider of TOP500 supercomputers will be optimizing Intel’s full portfolio of HPC and AI hardware and software solutions to serve as the foundation for its market strategy. Working together, the companies aim to accelerate the convergence of HPC and AI to unlock new levels of customer insight. The combination of 2nd Gen Intel® Xeon® Scalable platform and Lenovo Neptune™ liquid cooling technology has already produced remarkable results from joint engineering and utilizing a unique combination of HPC IP from the two companies. Today, 173 of the world’s TOP500 fastest supercomputers, spanning 19 markets run on Lenovo servers. Additionally, 17 of the world’s top 25 research universities rely on Lenovo infrastructure.

“Our goal is to further accelerate innovation into the Exascale era, aggressively waterfalling these solutions to scientists and businesses of all sizes to speed discovery and outcomes. We are passionate in helping researchers solve humanity’s greatest challenges,” said Kirk Skaugen, executive vice president of Lenovo and president of Lenovo Data Center Group. “Lenovo’s Neptune™ liquid cooling, in combination with the 2nd Gen Intel® Xeon® Scalable platform, helps customers unlock new insights and deliver unprecedented outcomes at new levels of energy efficiency.”

“Intel is laser-focused on helping our customers spur innovation and discovery through the convergence of AI with HPC,” said Navin Shenoy, Intel executive vice president and general manager of the Data Center Group. “Our extended collaboration with Lenovo combines the best of both companies’ innovations to drive our customers’ progress forward even faster.”

The collaboration plans to focus on three areas:

Systems and solutions: The collaboration brings together the best of Lenovo’s portfolio, including Lenovo TruScale Infrastructure™, and Intel’s leading-edge technologies, including Intel® Xe computing architecture; Intel® Optane™ DC persistent memory; Intel® oneAPI® programming framework; and both current and future generations of Intel® Xeon® Scalable processors, the only CPUs with the built-in AI acceleration of Intel® Deep Learning Boost. This partnership will be critical as breakthrough HPC and AI technologies are cascaded to users of any size, or what Lenovo calls “From Exascale to Everyscale™.”

Software optimization for HPC and AI convergence: A key focus area will be building out Lenovo’s smarter software offerings, including optimizing Lenovo’s LiCO HPC/AI software stack for Intel’s next-generation technologies, and alignment with the Intel oneAPI® programming framework. Additionally, the collaboration will work to enable DAOS advanced storage frameworks and other exascale-class software optimizations, targeted at helping HPC and AI users run their applications with greater ease than before.

Ecosystem enablement: Additionally, Intel and Lenovo plan to partner to help create the new ecosystem for the convergence of HPC and AI. This includes building joint “HPC & AI centers of excellence” around the world to further enable research and university centers to develop solutions that address some of the most pervasive world challenges, including genomics, cancer, weather and climate, space exploration and more.

Intel, Intel 2nd Gen Intel® Xeon® Scalable, Intel® Xe, Intel® Optane™ DC persistent memory, Intel® oneAPI®, Intel® Xeon® Scalable processors and Intel® Deep Learning Boost and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

 

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Intel Launches First 10th Gen Intel Core Processors: Redefining the Next Era of Laptop Experiences

Produits Intel - jeu, 01/08/2019 - 15:00
A photo shows the 10th Gen Intel Core processor on a motherboard. On Aug. 1, 2019, Intel launches 11 new, highly integrated 10th Gen Intel Core processors designed for remarkably sleek 2 in 1s and laptops. (Source: Intel Corporation)
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What’s New: Today, Intel officially launched 11 new, highly integrated 10th Gen Intel® Core™ processors designed for remarkably sleek 2 in 1s and laptops. The processors bring high-performance artificial intelligence (AI) to the PC at scale, feature new Intel® Iris® Plus graphics for stunning entertainment and enable the best connectivity1 with Intel® Wi-Fi 6 (Gig+) and Thunderbolt™ 3. Systems are expected from PC manufacturers for the holiday season.

“These 10th Gen Intel Core processors shift the paradigm for what it means to deliver leadership in mobile PC platforms. With broad-scale AI for the first time on PCs, an all-new graphics architecture, best-in-class Wi-Fi 6 (Gig+) and Thunderbolt 3 – all integrated onto the SoC, thanks to Intel’s 10nm process technology and architecture design – we’re opening the door to an entirely new range of experiences and innovations for the laptop.”
–Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms in the Client Computing Group

Why It Matters: 10th Gen Intel Core processors are foundational to Intel’s journey in enabling uncompromising and workload-optimized PC platforms with performance leadership across all vectors of computing. In addition to performance and responsiveness gains, AI, graphics, connectivity and I/O are optimized on the SoC for a solution that delivers a feature-rich suite of capabilities for OEMs to create laptops for people to watch, game and create more.

On Aug. 1, 2019, Intel launches 11 new, highly integrated 10th Gen Intel Core processors designed for remarkably sleek 2 in 1s and laptops. The processors feature new Intel Iris Plus graphics for stunning entertainment. (Source: Intel Corporation)
    Intelligent performance: 10th Gen Intel Core processors are the first purpose-built processors for AI on thin-and-light laptops and 2 in 1s. They deliver the intelligent performance needed for modern AI-infused applications, with a suite of features and capabilities:

    • Intel® Deep Learning Boost, a new, dedicated instruction set that accelerates neural networks on the CPU for maximum responsiveness in scenarios such as automatic image enhancements, photo indexing and photorealistic effects.
    • Up to 1 teraflop of GPU engine compute for sustained, high-throughput inference applications like video stylization, analytics and real-time video resolution upscaling.
    • Intel® Gaussian & Neural Accelerator (GNA) delivers a dedicated engine for background workloads such as voice processing and noise suppression at ultra-low power, for maximum battery life.

    All-new graphics for stunning entertainment: With double the graphics performance2, 10th Gen Intel Core processors with Intel Iris Plus graphics make a reality gaming in 1080p and higher-level content creation, like 4K video editing, quick application of video filters and high-resolution photo processing on the go. Plus:

    • These are the first GPUs from Intel to support VESA’s Adaptive Sync* display standard, which enables a smoother gaming experience across games like Dirt Rally 2.0* and Fortnite*.
    • Based on Intel’s Gen11 graphics architecture, they are also the industry’s first integrated GPU to incorporate variable rate shading for improved rendering performance.
    • With support for the BT.2020* specification, watch 4K HDR video in a billion colors.

    Best connectivity: Increased board integration3 helps PC manufacturers innovate on form factor for sleeker designs with Intel Wi-Fi 6 (Gig+) connectivity and up to four Thunderbolt 3 ports — the fastest and most versatile USB-C connector available4.

Microsoft’s POV: “The breadth of the full Windows experience on Intel Core processors is enhanced with the introduction of 10th Gen Intel Core processors,” said Mark Linton, general manager, Consumer and Device Sales, Microsoft Corp. “With the AI performance and technology boost on Intel’s platform, PC consumers will start to see their Windows operating system and everyday Microsoft applications accelerate modern machine learning approaches.”

Product Line-up:

Processor Number Graphics Cores / Threads Graphics (EUs) Cache Nominal TDP/
ConfigUP TDP
Base Freq (GHz) Max Single Core Turbo (GHz) Max All Core Turbo (GHz) Graphics Max Freq (GHz) Intel® DL Boost /

Intel® GNA U-Series Intel® Core™ i7-1068G7 Intel® Iris® Plus 4/8 64 8MB 28W 2.3 4.1 3.6 1.10 √ Intel® Core™ i7-1065G7 Intel® Iris® Plus 4/8 64 8MB 15W/25W 1.3 3.9 3.5 1.10 √ Intel® Core™ i5-1035G7 Intel® Iris® Plus 4/8 64 6MB 15W/25W 1.2 3.7 3.3 1.05 √ Intel® Core™ i5-1035G4 Intel® Iris® Plus 4/8 48 6MB 15W/25W 1.1 3.7 3.3 1.05 √ Intel® Core™ i5-1035G1 Intel® UHD Graphics 4/8 32 6MB 15W/25W 1.0 3.6 3.3 1.05 √ Intel® Core™ i3-1005G1 Intel® UHD Graphics 2/4 32 4MB 15W 1.2 3.4 3.4 0.90 √ Y-Series Intel® Core™ i7-1060G7 Intel® Iris® Plus 4/8 64 8MB 9W/12W 1.0 3.8 3.4 1.10 √ Intel® Core™ i5-1030G7 Intel® Iris® Plus 4/8 64 6MB 9W/12W 0.8 3.5 3.2 1.05 √ Intel® Core™ i5-1030G4 Intel® Iris® Plus 4/8 48 6MB 9W/12W 0.7 3.5 3.2 1.05 √ Intel® Core™ i3-1000G4 Intel® Iris® Plus 2/4 48 4MB 9W 1.1 3.2 3.2 0.90 √ Intel® Core™ i3-1000G1 Intel® UHD Graphics 2/4 32 4MB 9W 1.1 3.2 3.2 0.90 √

All with integrated Intel® Wi-Fi 6 (Gig+) and Thunderbolt™ 3

Intel is also introducing a new processor number naming structure starting with this first set of 10th Gen Intel Core processors. Read more about Intel processor numbers.

10th Gen Intel Core processors, code-named “Ice Lake,” are represented by a new processor naming structure indicating generation and the level of graphics performance.

What’s Next: The processors, code-named “Ice Lake,” are the first to debut in the 10th Gen Intel Core processor family and will be available in new designs from PC manufacturers for the holiday season. This year at Computex, Intel previewed some of the first systems expected to arrive and on track for verification through the innovation program code-named “Project Athena,” including Acer Swift 5*, Dell XPS 13 2-in-1*, HP Envy 13”* and Lenovo S940*.

Today’s announcement is just the beginning. Addressing the increasing diversity of modern computing needs, Intel will announce additional products in the 10th Gen Intel Core mobile processor family. The upcoming processors will deliver increased productivity and performance scaling for demanding, multithreaded workloads, including the flagship built-for-business Intel® vPro™ platform. Expect to hear more details this month.

More Context: 10th Gen Press Kit | 10th Gen Intel Core Product Brief | 10th Gen Intel Core Press Deck

The Small Print:

Intel, Intel Core, Thunderbolt and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

Performance results are based on testing as of dates shown in configuration and may not reflect all publicly available security updates. See configuration disclosure for details. No product or component can be absolutely secure. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit www.intel.com/benchmarks.

Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at intel.com.

Intel is a sponsor and member of the BenchmarkXPRT Development Community and was the major developer of the XPRT family of benchmarks. Principled Technologies is the publisher of the XPRT family of benchmarks. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases.

1Best in Class Wi-Fi 6: Intel® Wi-Fi 6 (Gig+) products support optional 160 MHz channels, enabling the fastest possible theoretical maximum speeds (2402 Mbps) for typical 2×2 802.11 AX PC Wi-Fi products.   Premium Intel® Wi-Fi 6 (Gig+) products enable 2-4X faster maximum theoretical speeds compared standard 2×2 (1201 Mbps) or 1×1 (600 Mbps) 802.11 AX PC Wi-Fi products, which only support the mandatory requirement of 80 MHz channels.

2Approx. 2x Ice Lake Graphics Performance: Workload: 3DMark11 v 1.0.132. Intel PreProduction ICL U4+2 15W Configuration (Assumptions):, Processor: Intel® Core™ i7 (ICL-U 4+2) PL1=15W TDP, 4C8T, Memory: 2x8GB LPDDR4-3733 2Rx8, Storage: Intel® 760p m.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 RS5-17763.316, Graphics driver: PROD-H-RELEASES_ICL-PV-2019-04-09-1006832. Vs config – Intel PreProduction WHL U4+2 15W Configuration (Measured), Processor: Intel® Core™ i7-8565U (WHL-U4+2) PL1=15W TDP, 4C8T, Turbo up to 4.6 GHz, Memory: 2x8GB DDR4-2400 2Rx8, Storage: Intel® 760p m.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 RS4-17134.112., Graphics driver: 100.6195. Measured by Intel as of April 2019.

3As compared to previous generation Intel Core U/Y-series processors

4Thunderbolt: As compared to other PC I/O connection technologies including eSATA, USB, and IEEE 1394 Firewire*. Performance will vary depending on the specific hardware and software used. Must use a Thunderbolt™-enabled device.

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Intel, Sequretek, Eclypsium and Perception Point Advance Threat Detection Solutions

Produits Intel - mer, 31/07/2019 - 23:15

What’s New: Next week at Black Hat 2019 in Las Vegas, hardware and firmware security will be a central topic of conference trainings and briefings. Intel and a growing number of companies in the industry continue to advance technologies that improve security at the lower layers of the computing stack with Intel® Threat Detection Technology (Intel® TDT) that complement built-in capabilities of our Intel® Xeon Scalable platforms for data-center infrastructure and Intel® Core processors for client computing.

“In today’s cybersecurity landscape, the attackers consistently discover novel attack vectors, exploiting any possible vulnerabilities – in software, firmware or hardware. To support the defense in-depth approach of our customers, Intel has enhanced threat detection at the foundation of the system stack. Our Threat Detection Technology provides security companies with a toolset to augment software-only solutions with hardware-level detectors.”
–Jim Gordon, Intel general manager of Platform Security

Why It Matters: The threat landscape is constantly evolving, and the rate and pace of security research for software and hardware products continues to accelerate. According to the National Institute of Standards and Technology (NIST), there were 13% more vulnerabilities reported in 2018 than in 2017.

Security solutions need to keep pace with the latest attacks, as well as infinite variations of known attack methods. All of this needs to be done with minimal impact on the customer experience. Intel’s hardware-based security technologies deliver two powerful capabilities: accelerated memory scanning and advanced platform telemetry.

How New Intel Customers Use the Technology:

Accelerated memory scanning is an industry enabler: Sequretek * is the latest company to work with Intel to integrate accelerated memory scanning in its endpoint detection, protection and response (EDPR) solution. With plans to release this solution in September 2019, early testing indicates significant performance improvement along with integration of Intel’s accelerated memory scanning stack. » More from Sequretek

Accelerated memory scanning in Intel TDT enables memory scanning that was rarely used due to its effect on system performance and power consumption. Intel offloaded the scanning for memory-based malware from CPU to the Intel integrated graphics processor (IGP). This change allows security solutions to use memory scanning broadly without introducing latency in the customer experience. Today, Intel TDT powers various innovative security technologies allowing detection of polymorphic malware, file-less threats and crypto miners.

Hardware indicators for advanced threat detection: Eclypsium*, an Intel Capital portfolio company and developer of the industry’s first firmware protection platform, announced its plans to work with Intel to advance firmware attack detection with Intel TDT Advanced Platform Telemetry, and deliver a new layer of security that helps defend the enterprise from its computing foundation up. » More from Eclypsium

Advanced platform telemetry addresses the challenge security software faces to help ensure reliable data feeds detect anomalies or specific behavior below the operating system. Everything that runs on Intel processors generates data from the CPU that can be applied to help detect threats. Intel CPUs can arm security providers with new levels of platform telemetry across PCs and servers to feed machine learning algorithms and improve the detection of advanced threats, while reducing false positives and minimizing performance impact.

Threat detection telemetry creates a framework for continuous innovation: Intel TDT doesn’t stop with providing detection techniques. The technology offers a framework to enable security companies to collect various telemetry and indicators from the hardware and create new and differentiated detection solutions.

Perception Point* identified the opportunity to leverage part of this framework in order to dramatically increase visibility into attacks. Its unique detonation environment specifically leverages Intel® Processor Trace (Intel PT), a data source originally developed for debugging as it exposes an accurate trace of activity with filtering capabilities that isolate the trace that matters. Perception Point utilizes Intel PT to record the full execution flow and identify anomalies in the code execution. This is a significant improvement over legacy sandboxes, which lack visibility due to operating at the application level, have latency issues and are limited in scale. Accessing the platform-level data exposed by Intel PT helps enable innovative security companies to better overcome these limitations. » More from Perception Point

More Context: Media Alert: Intel at Black Hat 2019 and DEF CON 27 | Security News at Intel

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SIGGRAPH: Intel’s Vision for Exascale-Class Content Creation with 1,000x Performance Advancement

Produits Intel - mer, 31/07/2019 - 04:00


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What’s New: At its inaugural Intel CREATE event today at SIGGRAPH 2019, the company outlined how its vision for exascale computing – driven by its six technology pillars – is foundational to enabling dramatic advancements in filmmaking and content creation. These advancements will be accelerated by a multiyear goal for a 1,000 times advancement in performance, underpinned by deep investments in next-generation hardware architectures and software developer tools.

“We’re relentless in our focus to drive the industry towards a world that unlocks exascale computing for everyone and enables creators to push the boundaries of visually rich and immersive storytelling. I’m deeply passionate about this future opportunity and have challenged my teams to pursue a goal of 1,000 times performance advancement over the coming years to enable this.”
–Raja M. Koduri, Intel chief architect and senior vice president of Architecture, Software and Graphics

What It Looks Like: Two examples of these investments coming to life are Intel’s forthcoming exascale-class GPU and Intel’s comprehensive roadmap for its oneAPI Rendering Toolkit (formerly Intel® Rendering Framework).

Additionally, breakthroughs in memory technology, like those delivered by 2nd Gen Intel® Xeon® Scalable processorscoupled with Intel® Optane™ DC persistent memory, put a higher class of computing performance in closer proximity to content creators. Industry collaboration remains core to Intel’s approach in these areas and spans industry leaders, academic researchers and technology innovators. These relationships allow for the development of workflows that enable the creation of content without compromise today, while preparing for tomorrow’s visual experiences driven by the promise of exascale computing.

Why It’s Important: Exascale computing will unlock new opportunities for fast, high-quality rendering, physical simulations and new artificial intelligence-supported workflows, expanding creation possibilities in studios.

“Only Moore’s Law will deliver compute to meet the dreams of real creators,” said Jim Keller, Intel senior vice president and general manager of Silicon Engineering Group.

Moving, storing and processing data in these complex scenarios requires advancements across the computing spectrum, including architecture (CPU and GPU), memory, I/O and, most important, the software that connects it to the artists.

“The path to exascale computing and content creation have strong interdependencies and opportunities between them. The advancements we make in these areas can be readily shared across both domains to their mutual benefit,” said Jim Jeffers, senior principle engineer and senior director of Intel’s Advanced Rendering and Visualization team. “Our investment in software initiatives, like oneAPI plus advanced algorithm research and development, plays a profound role as we set out to ‘leave no transistor behind’.”

The Intel® oneAPI Rendering Toolkit – used by more than 100 applications developed in-house and by independent software vendors (ISVs) today – is a set of highly optimized software libraries that enable efficient, high-quality rendering for data of virtually any size. Intel shared its roadmap for the Intel oneAPI Rendering Toolkit through the end of 2019, including new and upcoming releases:

Available this week:

  • Intel® Embree v3.6 is the latest version of high-performance ray-tracing kernels
  • Intel® Open Image Denoise v1.0 uses AI Deep Learning techniques to deliver leadership quality images to speed ray-tracing applications’ rendering time

Available by 2019’s fourth quarter:

  • Intel® OSPRay v2.0, the open source, scalable, ray-tracing engine, will incorporate Intel® Open Image Denoise v1.0
  • Intel® Open Volume Kernel Library for volumetric rendering

How Intel Collaborates: Industry giants showcased how they are leveraging Intel’s products and technologies to advance content creation possibilities:

  • Pixar* highlighted the collaboration with Intel to allow Renderman to enable over 2 times acceleration1 of the Open Shading Language by taking advantage of Intel Xeon Scalable processor SIMD vector instructions like AVX-512. Pixar noted its plans to extend its Renderman xPU research and development to upcoming Intel Xearchitecture GPUs to utilize the oneAPI software concept of “no transistor left behind.”
  • HP* discussed how Intel Optane DC persistent memory can be used to eliminate the need for slow and disruptive manual and/or auto-saves in content creation applications. Additionally, HP showed how persistent memory can be leveraged to preserve work history across application and system transitions as demonstrated at the event on Blender, allowing creators to rapidly pick up where they left off.
  • CHAOS Research* announced a new collaboration with Intel and Charles University in Prague to form a new Intel® Graphics and Visualization Institute of XeLLENCE to advance research in professional rendering technologies.
  • Discovery* announced a new science education digital series, a new collaboration with Intel, coming this fall that will use the Intel oneAPI Rendering Toolkit to deliver stunning, high-fidelity visualizations to better educate viewers.
  • Maxon* shared how it is leveraging Intel® Embree and Intel® Open Image Denoise in Cinema4D R21 to deliver even faster rendering times and announced a technical partnership with Intel on future CPU and GPU technology.
  • BlueSky Studios* showcased how large persistent memory can change the way creators work by enabling tasks that were simply not possible before, such as multi-TB rendering jobs.
  • Otoy* disclosed that it will be supporting the Vulkan API going forward in Octane Render, citing the need for industry standards to take advantage of the best hardware available.

More Context: Exascale Computing will Redefine Content Creation

The Small Print:

1 Testing by Pixar on July 17, 2019, indicating 2x total render time with shading alone measuring 2.4x faster on Intel® Xeon Gold 6152 at 2.10 GHz (22 c).

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.

Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit www.intel.com/benchmarks.

Performance results are based on testing as of the date in the configurations and may not reflect all publicly available security updates.  See configuration disclosure for details.  No product or component can be absolutely secure.

Intel does not control or audit third-party data. You should visit other sources to confirm whether referenced data are accurate.

The post SIGGRAPH: Intel’s Vision for Exascale-Class Content Creation with 1,000x Performance Advancement appeared first on Intel Newsroom.

Intel Reports Second-Quarter 2019 Financial Results

Produits Intel - jeu, 25/07/2019 - 22:10

Intel Corporation’s second-quarter 2019 earnings news release and presentation are available on the company’s Investor Relations website. The earnings conference call for investors begins at 2 p.m. PDT today; a public webcast will be available at www.intc.com.

» Click for full infographic

The post Intel Reports Second-Quarter 2019 Financial Results appeared first on Intel Newsroom.

Apple to Acquire Majority of Intel’s Smartphone Modem Business

Produits Intel - jeu, 25/07/2019 - 22:00

SANTA CLARA and CUPERTINO, Calif., July 25, 2019 – Intel and Apple have signed an agreement for Apple to acquire the majority of Intel’s smartphone modem business. Approximately 2,200 Intel employees will join Apple, along with intellectual property, equipment and leases. The transaction, valued at $1 billion, is expected to close in the fourth quarter of 2019, subject to regulatory approvals and other customary conditions, including works council and other relevant consultations in certain jurisdictions.

Combining the acquired patents for current and future wireless technology with Apple’s existing portfolio, Apple will hold over 17,000 wireless technology patents, ranging from protocols for cellular standards to modem architecture and modem operation. Intel will retain the option to develop modems for non-smartphone applications, such as PCs, internet of things devices and autonomous vehicles.

“This agreement enables us to focus on developing technology for the 5G network while retaining critical intellectual property and modem technology that our team has created,” said Intel CEO Bob Swan. “We have long respected Apple and we’re confident they provide the right environment for this talented team and these important assets moving forward. We’re looking forward to putting our full effort into 5G where it most closely aligns with the needs of our global customer base, including network operators, telecommunications equipment manufacturers and cloud service providers.”

“We’ve worked with Intel for many years and know this team shares Apple’s passion for designing technologies that deliver the world’s best experiences for our users,” said Johny Srouji, Apple’s senior vice president of Hardware Technologies. “Apple is excited to have so many excellent engineers join our growing cellular technologies group, and know they’ll thrive in Apple’s creative and dynamic environment. They, together with our significant acquisition of innovative IP, will help expedite our development on future products and allow Apple to further differentiate moving forward.”

Advisors
Goldman Sachs & Co. LLC served as financial advisor to Intel, and Skadden, Arps, Slate, Meagher & Flom LLP and Sullivan & Cromwell LLP served as legal advisors.

About Intel
Intel (NASDAQ: INTC), a leader in the semiconductor industry, is shaping the data-centric future with computing and communications technology that is the foundation of the world’s innovations. The company’s engineering expertise is helping address the world’s greatest challenges as well as helping secure, power and connect billions of devices and the infrastructure of the smart, connected world – from the cloud to the network to the edge and everything in between. Find more information about Intel at newsroom.intel.com and intel.com.

About Apple
Apple revolutionized personal technology with the introduction of the Macintosh in 1984. Today, Apple leads the world in innovation with iPhone, iPad, Mac, Apple Watch and Apple TV. Apple’s four software platforms — iOS, macOS, watchOS and tvOS — provide seamless experiences across all Apple devices and empower people with breakthrough services including the App Store, Apple Music, Apple Pay and iCloud. Apple’s more than 100,000 employees are dedicated to making the best products on earth, and to leaving the world better than we found it.

Forward-Looking Statements
This press release contains forward-looking statements relating to the pending sale of the majority of Intel’s smartphone modem business to Apple, including statements regarding the benefits and the timing of the transaction, as well as forward-looking statements relating to Intel’s future plans and expectations, total addressable market and market opportunity, future products and technology and the expected benefits of such products and technology, and anticipated trends in Intel’s businesses and the markets relevant to them. Words such as “anticipates,” “expects,” “intends,” “goals,” “plans,” “believes,” “seeks,” “estimates,” “continues,” “may,” “will,” “would,” “should,” “could,” and variations of such words and similar expressions are intended to identify such forward-looking statements. All forward-looking statements included in this release are based on management expectations as of the date of this release and, except as required by law, Intel and Apple disclaim any obligation to update these forward-looking statements to reflect future events or circumstances. Forward-looking statements involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in such statements. Such risks and uncertainties include the outcome of regulatory reviews of the transaction, the outcome of works council consultations and other relevant consultations in certain jurisdictions related to the transaction, the ability of the parties to complete the transaction in the time expected or at all, litigation or regulatory matters affecting the closing of the transaction, and other risks detailed in Intel’s and Apple’s SEC filings, including the companies’ most recent reports on Form 10-K, Form 10-Q, and Form 8-K, which are available at the SEC’s website at www.sec.gov. Copies of Intel’s SEC filings may also be obtained by visiting Intel’s Investor Relations website at www.intc.com, and copies of Apple’s SEC filings may be obtained by visiting Apple’s Investor Relations website at investor.apple.com.

The post Apple to Acquire Majority of Intel’s Smartphone Modem Business appeared first on Intel Newsroom.

Media Alert: Intel at Black Hat 2019 and DEF CON 27

Produits Intel - mer, 24/07/2019 - 19:00

Join Intel for trainings, briefings and talks at Black Hat 2019 and DEF CON 27 in Las Vegas. Learn about how Intel, together with partners and customers, is building the trusted foundation for computing in a data-centric world.

BLACK HAT 2019

Where: Mandalay Bay, Las Vegas

When: Aug. 3-8, 2019

DEF CON 27

Where: Paris, Ballys, Flamingo and Planet Hollywood Hotels, Las Vegas

When: Aug. 8-11, 2019


Maggie Jauregui Black Hat Trainings: Applied Hardware Attacks 1 — Embedded and IoT Systems Training and Applied Hardware Attacks 2 — Hardware Pentesting

Maggie Jauregui, Intel security researcher, along with Josh Datko and Thorsten Haas are part of a team of researchers supporting renowned hardware hacker Joe FitzPatrick delivering two hardware security classes at Black Hat. The first training will focus on spending time hands-on with current off-the-shelf hardware. The class will introduce participants to common interfaces on embedded MIPS and ARM systems, and how to exploit physical access to grant software privilege. The second training will focus on putting new skills to the test to analyze how and why hardware hacks belong in scope of certain pen tests, and what that means for threat modeling and deliverables.

When: Saturday and Sunday, Aug. 3-4, 2019

The Applied Hardware Attacks trainings 1 and 2 are SOLD OUT.

  Yanai Moyal Black Hat Briefing: Behind the Scenes of Intel Security and Manageability

Shai Hasarfaty, Intel principal security research engineer, and Yanai Moyal, Intel security researcher, will discuss Intel’s security engine, CSME (Converged Security and Manageability Engine) and its key security value to the platform. They will share how other firmware environments can achieve the same technology.

When: Wednesday, Aug. 7, 1:30-2:20 p.m. PDT

Where: Mandalay Bay, Islander EI Ballroom

Black Hat 2019 Registration: Link to register Amit Elazari DEF CON Talk at IoT Village organized by Independent Security Evaluators — Regulatory Trends in IoT Security and Impact on the Research Community

Amit Elazari, Intel director of global cybersecurity policy, presents an introduction into the variety and influx of legal and regulatory concepts and proposals shaping the future of IoT security. Her talk will focus specifically on proposed bills, IoT Security core capabilities, anti-hacking laws, and the standards efforts and new security laws taking effect in California and Oregon.

When: Friday, Aug. 9, 12:30-1 p.m. PDT

Where: IoT Village organized by Independent Security Evaluators, a security consulting and research firm.

Registration: Cost for all four days is $300, cash at the door

Contact:

Megan Grasty
Highwire Public Relation
916-834-0802
megan@highwirepr.com

 

The post Media Alert: Intel at Black Hat 2019 and DEF CON 27 appeared first on Intel Newsroom.

Intel Declares Quarterly Cash Dividend

Produits Intel - jeu, 18/07/2019 - 15:30

SANTA CLARA, Calif., July 18, 2019 – Intel Corporation today announced that its board of directors has declared a quarterly dividend of $0.315 per share ($1.26 per share on an annual basis) on the company’s common stock. The dividend will be payable on September 1, 2019, to stockholders of record on August 7, 2019.

The post Intel Declares Quarterly Cash Dividend appeared first on Intel Newsroom.

Intel and SAP Broaden Their Technology Partnership to Power Enterprises’ Digital Transformation

Produits Intel - jeu, 18/07/2019 - 14:00

What’s New: Intel and SAP* today announced a multiyear technology partnership focused on optimizing Intel’s platforms, including Intel® Xeon™ Scalable processors and Intel® Optane™ DC persistent memory, for SAP’s end-to-end enterprise software applications, including SAP S/4HANA*. The partnership is designed to employ Intel’s leading technologies to power SAP’s suite of business solutions and intelligent technologies, enabling enterprises to deploy high-performance, highly-optimized applications within the cloud, enterprise and at the edge. A center of excellence (COE) is also planned to demonstrate the ability of Intel and SAP technology to provide strategic capabilities and enable digital transformation.

“For more than a decade, Intel and SAP have engaged closely on developing differentiated breakthrough technologies that make organizations run more efficiently, and with today’s news we will further accelerate our technology collaboration and grow the value that we deliver to our customers. Broadening our technology collaboration with SAP means our mutual customers will be able to achieve faster insights from the largest data challenges, delivering a competitive edge.”
–Navin Shenoy, Intel executive vice president and general manager of the Data Center Group

Why It Matters: Intel offers platform innovations consisting of processors, memory, storage and accelerator technologies that are capable of delivering SAP customers the performance and value required to accelerate leading-edge business applications. As an example, running SAP HANA*–based applications within Intel Optane DC persistent memory may significantly reduce the complexity and risk of running real-time in-memory applications by providing persistent data that is more resilient to computer outages, without compromising security. SAP HANA customers deploying Intel Optane DC persistent memory are capable of reducing data recovery times from 50 minutes to 4 minutes on a 6TB SAP HANA instance1. Intel Optane DC persistent memory delivers significantly denser memory, which enables customers to do more data processing within the same server – intended for cost savings and enabling new capabilities for customers converting to SAP S/4HANA.

“The platform innovation delivered across Intel Xeon Scalable processors and Intel Optane DC persistent memory unleash memory persistence and capacity that allows our customers to become intelligent enterprises in the Experience Economy,” said Irfan Khan, president, Platform and Technologies, SAP. “Our expanded partnership with Intel will accelerate our customers’ move to SAP S/4HANA by allowing organizations to unlock the value of data assets with greater ease and operate with increased visibility, focus and agility.”

What the Expanded Partnership Includes: The partnership will empower customers to transform mission-critical business processes by deploying leading-edge, high-performance applications running on Intel-based infrastructure in the cloud, on-premises and in hybrid environments. The technology partnership will aim to further optimize Intel Xeon Scalable processors and Intel Optane DC persistent memory for SAP HANA, while allowing customers to accelerate migration to SAP S/4HANA. Intel and SAP will also work to optimize Intel’s platforms for SAP’s wide range of enterprise applications, including the SAP* Leonardo portfolio of intelligent technologies (artificial intelligence, analytics, internet of things (IoT), big data and blockchain) as well as SAP Business Suite applications. Broadening the technology partnership will allow customers to deploy a variety of workloads within their business infrastructure and accelerate their organization’s digital transformation.

How the Center of Excellence Works: A joint Intel and SAP center of excellence is planned to include a dedicated team of professionals who will demonstrate to customers the ability of Intel and SAP technologies and provide strategic guidance on enabling their digital transformation. The CoE is designed for customers to visualize and understand the value of, and adopt Intel and SAP technologies in order to become an intelligent enterprise.

More Context: Intel and SAP Go Big – Here’s What You Need to Know

The Small Print:
1Performance results are based on testing as of May 30, 2018, and may not reflect all publicly available security updates. See configuration disclosure for details. No product can be absolutely secure. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark* and MobileMark*, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to www.intel.com/benchmarks.

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Intel CEO Says Customers Demand Solutions, Not Just Products

Produits Intel - mer, 17/07/2019 - 19:31
Bob Swan (left), Intel’s chief executive officer, speaks with Fortune executive editor Adam Lashinsky on Tuesday, July 16, 2019, during Fortune’s annual Brainstorm Tech conference in Aspen, Colorado. (Credit: Fortune Magazine)
» Click for full image

Speaking this week at Fortune‘s annual Brainstorm Tech conference, Intel CEO Bob Swan said that what differentiates Intel as computing grows in complexity is the company’s ability to deliver not just products, but solutions (or “platforms”) tuned for specific environments — from cloud data centers to autonomous cars.

“The role of the CPU continues to be incredibly strong,” Swan said. “In addition to that, what a lot of our customers are looking for — as their environments get more complicated — they are not just looking for the CPU or other pieces of hardware for their environment, they are increasingly looking for a platform.”

Swan asserted that Intel brings more capability and technology to this task than “anybody else on the planet.”

The comment comes as Intel transforms to a data-centric company, competing for a nearly $300 billion silicon market opportunity fueled by the growing need to process, move and store exponential amounts of data. Swan pointed to automotive as a market example where more computing horsepower is required to enable safety features today and autonomous cars in the future. This is a market where Intel is already thriving, thanks to its 2017 acquisition of Mobileye.

“I couldn’t be more thrilled about Mobileye being a part of Intel,” Swan said.

The on-stage discussion with Fortune’s executive editor, Adam Lashinsky, also touched on Swan’s “intense respect” for the brilliant engineers at Intel who are reinventing the company with a desire to change the world. He said his role as CEO is to “get them to dream through inquisition.”

» See the full discussion between Swan and Lashinsky below or on Fortune’s website.

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Innovation through Collaboration: Building Research Communities

Produits Intel - lun, 15/07/2019 - 22:30

By Rich Uhlig

We find ourselves in a world awash with data growing at an unprecedented rate. And that data is changing in nature with respect to how and where it is collected as we blanket the planet with new sensing technologies. Cameras, microphones and location sensors in our smart phones, attached to our vehicles and embedded in the environments in which we live and work are shifting the flows of data between centralized data centers and the network edge.

At the same time, Moore’s Law continues to expand what is possible to build in computing systems. The question is less about whether we can expect the economic benefits of Moore’s Law to continue (i.e., further reductions of cost per device over time) and more about whether we can manage the design and programming complexity that it affords.

More: Intel’s Pohoiki Beach, a 64-Chip Neuromorphic System, Delivers Breakthrough Results in Research TestsIntel Labs (Press Kit)

As I discussed during my presentation at the DARPA Electronics Resurgence Initiative (ERI) Summit in Detroit this week, continuing to achieve the types of gains Moore’s Law enables requires work that cannot be done in silos. Aligned to the ERI mission, Intel is pushing this forward through industry and academic collaborations. To move from lab research to real-world impact requires a truly integrated systems view and a commitment to collaboration across a spectrum of research areas.

That is our approach at Intel Labs. We start with a bold mission, explore solutions, create prototypes and nurture communities to reach the end goal. We work with academia, industry and government organizations such as DARPA at various steps of this process. Together, we explore the development of architectures that use specialized hardware – and software – to solve computing problems more quickly and efficiently. Doing so requires opening our innovations to the broad research community to push every breakthrough further.


» Download all images (ZIP, 43 MB)

Our work with neuromorphic computing provides a good example. We set a goal to achieve several orders of magnitude improvement in energy efficiency (think greater than 1,000 times) for selected workloads like sparse coding, constraint satisfaction, path planning and adaptive control – tasks that we believe will be important as data increasingly must be processed at the edge in realtime and in energy-constrained environments.

We publicly kicked off our neuromorphic work in 2017 when we introduced Loihi, a brain-inspired research chip, to an ecosystem of research partners.

In March 2018, we established the Intel Neuromorphic Research Community (INRC) to further the development of neuromorphic algorithms, software and applications. We have granted INRC members access to accelerate their research through Loihi cloud systems and USB form factors. Their work has spurred new investigations into real-world applications for neuromorphic technologies. We are already seeing a series of publications coming from researchers in the INRC about creative new applications for neuromorphic computing and impressive performance and efficiency results.

Today, we announced Pohoiki Beach, which accelerates this effort by providing greater computational scale and capacity to Intel’s research partners. Pohoiki Beach brings together 64 Loihi chips, each with 128 cores, enabling the efficient modeling of a system of about 8 million neurons.  We hope that providing ever-increasing scale of neuromorphic computing platforms will enable the research community to tackle entirely new classes of problems.

This work is a natural extension of the technology innovations we have pioneered for decades. But we can’t do it alone in our silo. To keep pressing forward the logical – and exciting – evolution of Moore’s Law requires collaboration across the entire research ecosystem.

Rich Uhlig is an Intel senior fellow and the director of Intel Labs.

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Intel’s Pohoiki Beach, a 64-Chip Neuromorphic System, Delivers Breakthrough Results in Research Tests

Produits Intel - lun, 15/07/2019 - 15:30


» Download all images (ZIP, 43 MB)
What’s New: Today, Intel announced that an 8 million-neuron neuromorphic system comprising 64 Loihi research chips — codenamed Pohoiki Beach — is now available to the broader research community. With Pohoiki Beach, researchers can experiment with Intel’s brain-inspired research chip, Loihi, which applies the principles found in biological brains to computer architectures. Loihi enables users to process information up to 1,000 times faster and 10,000 times more efficiently than CPUs for specialized applications like sparse coding, graph search and constraint-satisfaction problems.

“We are impressed with the early results demonstrated as we scale Loihi to create more powerful neuromorphic systems. Pohoiki Beach will now be available to more than 60 ecosystem partners, who will use this specialized system to solve complex, compute-intensive problems.”
–Rich Uhlig, managing director of Intel Labs

Why It’s Important: With the introduction of Pohoiki Beach, researchers can now efficiently scale up novel neural-inspired algorithms — such as sparse coding, simultaneous localization and mapping (SLAM), and path planning — that can learn and adapt based on data inputs. Pohoiki Beach represents a major milestone in Intel’s neuromorphic research, laying the foundation for Intel Labs to scale the architecture to 100 million neurons later this year.

Why It’s Different: Continuing the gains in power and performance enabled by Moore’s Law will require more than continued process-node scaling. As new complex computing workloads become the norm, there is a growing need for specialized architectures designed for specific applications.

The Pohoiki Beach neuromorphic system demonstrates the benefits of a specialized architecture for emerging applications, including some of the computational problems hardest for the internet of things (IoT) and autonomous devices to support. By using this type of specialized system, as opposed to general-purpose computing technologies, we can expect to realize orders of magnitude gains in speed and efficiency for a range of real-world applications, from autonomous vehicles to smart homes to cybersecurity.

What Our Research Partners are Saying: With the introduction of Pohoiki Beach, Intel will allow ecosystem partners worldwide to continue to pioneer the next frontier of neural-inspired algorithmic research.

At the Telluride Neuromorphic Cognition Engineering Workshop this week, for example, researchers are using Loihi systems to solve challenges at the cutting edge of neuromorphic engineering. Projects include providing adaptation capabilities to the AMPRO prosthetic leg, object tracking using emerging event-based cameras, automating a foosball table with neuromorphic sensing and control, learning to control a linear inverted pendulum, and inferring tactile input to the electronic skin of an iCub robot.

In addition to the work coming out of Telluride, other research partners are already seeing the benefits of Loihi at scale:

“With the Loihi chip we’ve been able to demonstrate 109 times lower power consumption running a real-time deep learning benchmarkcompared to a GPU, and 5 times lower power consumption compared to specialized IoT inference hardware,” said Chris Eliasmith, co-CEO of Applied Brain Research and professor at University of Waterloo. “Even better, as we scale the network up by 50 times, Loihi maintains real-time performance results and uses only 30 percent more power, whereas the IoT hardware uses 500 percent more power and is no longer real-time.”

“Loihi allowed us to realize a spiking neural network that imitates the brain’s underlying neural representations and behavior. The SLAM solution emerged as a property of the network’s structure. We benchmarked the Loihi-run network and found it to be equally accurate while consuming 100 times less energy than a widely used CPU-run SLAM method for mobile robots,” professor Konstantinos Michmizos of Rutgers University said while describing his lab’s work on SLAM to be presented at the International Conference on Intelligent Robots and Systems (IROS) in November.

What’s Next: In 2017, Intel introduced Loihi, its first neuromorphic research chip, taking a major step forward in the development of neuromorphic hardware. In March 2018, the company established the Intel Neuromorphic Research Community (INRC) to further the development of neuromorphic algorithms, software and applications. Through INRC, Intel provides access to its Loihi cloud systems and Kapoho Bay, a Loihi-based USB form factor system, which has invigorated research on real-world applications for neuromorphic technologies.

Today’s announcement of Pohoiki Beach accelerates this effort by providing greater computational scale and capacity to Intel’s research partners.

Later this year, Intel will introduce an even larger Loihi system named Pohoiki Springs, which will build on the Pohoiki Beach architecture to deliver an unprecedented level of performance and efficiency for scaled-up neuromorphic workloads.

Intel’s engineers expect that measurements from these research systems will quantify the gains that are achievable with neuromorphic-computing methods and will clarify the application areas most suitable for the technology. This research paves the way for the eventual commercialization of neuromorphic technology.

More Context: Intel Labs (Press Kit)

The post Intel’s Pohoiki Beach, a 64-Chip Neuromorphic System, Delivers Breakthrough Results in Research Tests appeared first on Intel Newsroom.

Creating New Technologies to Keep Moore’s Law Alive and Well

Produits Intel - mer, 10/07/2019 - 17:00
Robert Chau, Intel Senior Fellow in Technology Development, directs Intel’s Components Research team that invents and develops novel materials, devices, interconnects, patterning and packaging used in Intel technology. (Credit: Walden Kirsch/Intel Corporation)

How he’d describe his job to a 10-year-old: “My team and I work with physics and chemistry to invent very cool technologies for making very cool products that change the world and that people would want to buy.”

More: Read about all Intel Innovators

Working on tomorrow’s problems: Chau directs Intel’s Components Research team of 105 engineers. They invent and develop novel materials, devices, interconnects and packaging used in Intel microprocessors, system-on-chip and 5G devices. They look for new tactics – some of them won’t be used for 5 to 10 years – to improve transistor and system performance and overcome the problems of physics that arise as chips’ features shrink to the atomic scale. “Our job is to invent, to demonstrate and to develop game-changing and revolutionary processing and packaging technologies to enable Intel’s process technology and product leadership,” says Chau, a member of the U.S. National Academy of Engineering and the recipient of the 2015 Intel Inventor of the Year award.

The starting point for revolutionary tech: Intel’s Components Research engineers have filed more than 1,600 patents in the last five years. Their work has been the foundation for many industry-first technologies, including high-k metal gate technologyTri-gate 3D transistorsstrained siliconEMIB package technology and extreme ultraviolet lithography technology. “We need to make sure Intel’s R&D pipeline is always full,” says Chau, a 31-year Intel employee with 440 granted patents.

Where silicon research starts: Chau’s Components Research team has strong internal collaboration with the Intel business units, Intel Labs, Logic Technology Development and Assembly Test Technology Development. Outside of Intel, the team has strong external collaboration with suppliers and universities. “Silicon research and development starts with us,” he says, “then goes to the technology development teams in Oregon and Arizona for chips and packaging, respectively, then to high-volume manufacturing in our global factories.”

The keeper of Moore’s Law: “Our job is to make sure Moore’s Law is alive and well. It’s a law of economics but it takes physics, chemistry, new materials and new architecture to keep it going. It can evolve into different forms over time, but we want to make sure we have the innovations and technologies to keep it going.”

Where Moore’s Law goes next: “Moore’s Law is more alive than ever, in my opinion, because now we’re thinking about heterogeneous 3D integration, both monolithically and at the package and system level – how to stack and put more devices in a vertical manner up and down.” Chau describes recent trips to Singapore and Hong Kong – large cities with small geographic footprints. “They are not spreading out,” he says, “they are building taller vertical skyscrapers and deeper and bigger underground shopping malls. That’s essentially what we are doing on our chips to accommodate the increasing number of transistors.”

Passion drives invention: “We don’t just sit here and say, ‘Hey, I invent.’ Invention is about human spirit and passion,” Chau says. “So, to be inventive, you have to be really passionate about what you’re doing. Invention is not routine, it’s not mundane. Inventions come from passion.”

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